Plastic integrated circuit card with reinforcement structure separated from integrated circuit module by card

ABSTRACT

A reinforcement structure to protect an integrated circuit module located within a smart card. The smart card has two semi-rigid layers, with a first opening through the first layer located below the second layer. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, has a first portion extending through the first opening and a second portion extending over the upper surface of the first card layer. The integrated circuit module is positioned in the second card layer and is separated from the reinforcement structure by the second card layer. The reinforcement structure, which can have various shapes, relives stress on the integrated circuit module during bending and torsion of the card.

This application is a division of application Ser. No. 08/197,022, filedFeb. 14, 1994, now U.S. Pat. No. 5,581,445.

FIELD OF THE INVENTION

The present invention relates to protection of an integrated circuitmodule.

BACKGROUND OF THE INVENTION

There are a wide variety of applications that can make use of a flexiblestructure including electronic and/or electromagnetic devices, thedevices being used for information input and output to and from theflexible structure, information processing and information storage. Oneexample of such a flexible structure is a flexible identification card.

An identification card, as defined by the International StandardsOrganization (ISO) in ISO 7810, is " a! card identifying its bearer andissuer which may carry data required as input for the intended use ofthe card and for transactions based thereon." Identification cards canhave one of three nominal sizes (as specified in ISO 7810): 1) 3.370inch (85.60 mm) width, 2.125 inch (53.98 mm) height, 0.030 inch (0.76mm) thickness; 2) 4.134 inch (105 mm) width, 2.913 inch (74 mm) height,0.030 inch (0.76 mm) thickness; 3) 4.921 inch (125 mm) width, 3.465 inch(88 mm) height, 0.030 inch (0.76 mm) thickness.

Some identification cards include an integrated circuit and are known as"integrated circuit cards" or "smart cards." More generally, herein,"smart card" refers to any portable card-like device which includes oneor more electronic components, i.e., active components such asintegrated circuits, transistors and diodes, and passive components suchas resistors, capacitors and inductors. The integrated circuits can beformed on an integrated circuit chip and/or printed circuit board thatis, in turn, attached to the main body of the smart card. Smart cardscan be used for a wide variety of applications such as prepaid "debit"cards (e.g., phone cards, transit passes, electronic purse), subscribercards (e.g., bank ATM cards, credit cards, point-of-sale cards), loyaltyscheme cards (e.g., frequent flier cards), security access andidentification cards, health insurance and service cards (with optionalprotected memory), GSM (global system management for European CellularPhones) cards and encryption/decryption cards.

Smart cards are used with a reader/writer that includes an interface("external interface") that is used to transmit information to or fromthe smart card. Some smart cards include electrical contacts which areused to make electrical connection between electrical circuitry on orwithin the smart card and the external interface i.e., contact-typesmart cards. Other smart cards do not include electrical contacts andaccomplish the transfer of information to and from the smart cardthrough another means such as, for example, an inductive coil formed inor on the smart card that is used in combination with an externalinterface that produces and responds to an electromagnetic field, i.e.,electromagnetic contact-less smart cards. Other types of contact-lesscards use electro-static or capacitive coupling to accomplish thetransfer of data and instructions to and from the card.

ISO 7816-1 sets forth the standards for bending and torsion which mustbe met by integrated circuit cards. The standard provides:

A.1 Bending properties

A.1.1 Procedure Place the card between the two jaws of a machine, one ofthem being a moving part and bend

a) the long side:

deflection (f): 2 cm;

periodicity: 30 bendings per minute;

b) the short side:

deflection (f): 1 cm;

periodicity: 30 bendings per minute; Check the functioning of the cardin the writing or reading mode every 125 bendings. Recommended testduration: at least 250 passes in each of the four test orientations.

A.1.2 Criteria for acceptability The card shall still function and shallnot show any cracked part after 1,000 bendings.

A.2 Torsion properties

A.2.1 Procedure Place the card in a machine which applies torsion to itsshort sides, the maximum displacement being through 15°±1° in alternatedirections at a rate of 30 torsions per minute. Check the correctfunctioning of the card in the writing and/or reading mode (asappropriate) every 125 torsions.

A.2.2 Criteria for acceptability The card shall still function and shallnot show any cracked part after 1,000 torsions.

Accordingly, it is desirable to have a integrated circuit card which isable to meet the bending and torsion requirements of this standard.

SUMMARY OF THE INVENTION

Accordingly, a card having a reinforcement structure 15 disposed withinone or more layers of the card is provided. The reinforcement structurehas a higher modulus of elasticity (it is stiffer) than the card. Amodule containing an electronic component is also disposed within one ormore layers of the card. The reinforcement structure relieves stresswhich would otherwise be experienced by the module during bending andtorsion of either contact-type or contact-less cards.

This invention will be more fully understood in light of the followingdrawings taken together with the detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross section of a typical integrated circuit module whichis located within a card;

FIG. 2 is a cross section of a single layer, contact-type card having awasher-type reinforcement structure;

FIG. 3 is a top view of various washer-type reinforcement structurespositioned on a card;

FIG. 4 is a cross section of a single layer contact-less card having aplate-type reinforcement structure;

FIG. 5 is a top view of various plate-type reinforcement structurespositioned on a card;

FIG. 6 is a cross section of a single layer contact-less card having acap-type reinforcement structure;

FIGS. 7a-d are isometric views of various cap-type reinforcementstructures;

FIG. 8 is a cross section of a single layer contact-type card having awasher-type reinforcement structure;

FIG. 9 is a cross section of a single layer contact-type card having aplate-type reinforcement structure;

FIG. 10 is a cross section of a single layer contact-type card having acap-type reinforcement structure;

FIG. 11 is a cross section of a molded contact-less card having awasher-type reinforcement structure;

FIGS. 12-17 are cross sections of different embodiments of two layercontact-less cards, each card having a reinforcement structure;

FIGS. 18-21 are cross sections of different embodiments of two layercontact-type cards, each card having a reinforcement structure;

FIGS. 22-24 are cross sections illustrating the steps used to create thecard of FIG. 21;

FIGS. 25-28 are cross sections of different embodiments of two layercontact-type cards, each card having a reinforcement structure;

FIGS. 29-31 are cross sections of contact-less cards having areinforcement structure which receives a module;

FIGS. 32-34 are cross sections of contact-type cards having areinforcement structure which receives a module;

FIG. 35 is a cross section of a card which is being bent;

FIG. 36 is a cross section of a contact-type card having a structuresimilar to the card of FIG. 21, in which an additional layer is added;

FIG. 37 is a cross section of a card according to an alternateembodiment of the present invention;

FIGS. 38a-d are cross sections illustrating a method for fabricating thecard of FIG. 37;

FIGS. 39 and 40 are cross sections of cards which illustrate alternateembodiments of the card of FIG. 37; and

FIGS. 41 and 42 are cross sections of cards according to alternateembodiments of the present invention.

DETAILED DESCRIPTION

FIG. 1 illustrates a cross section of a typical integrated circuitmodule 101 which is located within a card of the present invention.Module 101 includes a substrate 103, an electronic component 105, and anencapsulant 107. Electrical contacts, such as electrical contact 108(shown in enlarged detail), are formed on the underside of substrate 103to provide access to an external interface for a contact type card.Module 101 must be protected during bending or torsion of the card inwhich the module is located. Inadequate protection may result in damageto the integrated circuit module 101 which may further result in failureof the card.

FIG. 2 is a cross section of a single layer contact-type card inaccordance with the present invention. The card 200 is constructed of asingle layer 201 having an upper surface 202 and a lower surface 203.Layer 201 may be made of a material including plastics such aspolyester, polyvinyl chloride (PVC), polycarbonate,polyethelynetelephthalate (PET) and polysulfone. First opening 231 andsecond opening 232 are formed in the upper surface 202 of layer 201.Reinforcement structure 220 is affixed in first opening 231 using anadhesive such as an acrylic adhesive, a thermal set adhesive, or anyother suitable adhesive. In an alternate embodiment, a molding compound,such as a molding epoxy or a polyphenylene sulfide molding compound, inliquid form, is placed in first opening 231. The molding compound isthen cured to form solid reinforcement structure 220. Integrated circuitmodule 230 is similarly affixed in second opening 232. Contacts, such ascontact 208 on the surface of the module 230, are exposed at the uppersurface 202 of layer 201. First and second openings 231-232 are formedby punching, milling, machining or etching layer 201. First and secondopenings 231-232 do not extend completely through layer 201 and aredimensioned to closely receive reinforcement structure 220 and module230, respectively. Various materials may be used to make reinforcementstructure 220 in accordance with the present invention. Acceptablematerials include plastics such as polyester, PVC, polycarbonate, PETand polysulfone, metals, fabrics, and graphite composite materials. Thematerial used for the reinforcement structure 220 preferably has ahigher modulus of elasticity than the material for layer 201. It isunderstood that, (1) the reinforcement structures and modules shown inFIGS. 2-36 are enlarged with respect to the layer(s) of the cards tobetter illustrate these elements and (2) the gaps shown between thereinforcement structures, the modules and the card layer(s) aresimilarly enlarged.

Reinforcement structure 220 is a washer-type reinforcement structure.That is, the reinforcement structure substantially laterally surroundsthe module 230. FIG. 3 is a top view of various washer-typereinforcement structures in accordance with the present invention.Circular reinforcement structure 301, square reinforcement structure302, rhombic reinforcement structure 303 and octagonal reinforcementstructure 304 protect modules 301a, 302a-302b, 303a and 304a,respectively, on card 300. Any polygonal or round (including an ovalshape) shape may be used for a washer-type reinforcement structure. Awasher-type reinforcement structure may also consist of a "broken" shapeas shown by the "broken" circular reinforcement structure 305, whichprotects module 305a. A washer-type reinforcement structure may alsoconsist of more than one piece as shown by reinforcement structure 306which protects module 306a. A washer type reinforcement structure mayalso consist of concentric reinforcement structures as shown byreinforcement structures 307 and 308. These reinforcement structuresprovide increased protection for module 307a by further stiffening thearea of the card surrounding module 307a. More than two concentricreinforcement structures may be used to form a reinforcement structure.In fact, a washer-type reinforcement structure can be virtually anysize, shape or geometry as long as it substantially laterally surroundsthe module which it is protecting. FIG. 3 also illustrates several otheraspects of the present invention. First, certain embodiments of thepresent invention utilize more than one reinforcement structure and/ormodule on a single card. In addition, a reinforcement structure/modulepair may be located at various positions within the card. Furthermore,more than one module may be disposed within a single reinforcementstructure.

FIG. 4 is a cross section of a reinforcement structure for a singlelayer contact-less card. In this embodiment, the reinforcement structure420 is a plate-type reinforcement structure disposed into first opening431 in upper surface 402 of layer 401. Module 430 is disposed intosecond opening 432. The plate-type reinforcement structure issubstantially planar. FIG. 5 is a top view of various plate-typereinforcement structures in accordance with the present invention.Circular reinforcement structure 501, square reinforcement structure502, rhombic reinforcement structure 503 and octagonal reinforcementstructure 504 protect underlying modules 501a, 502a-502b, 503a and 504a,respectively, on card 500. Any polygonal or round shape may be used fora plate-type reinforcement structure. A plate-type reinforcementstructure, such as reinforcement structure 505, can be combined with awasher-type reinforcement structure, such as reinforcement structure 506to protect a module such as module 505a.

FIG. 6 is a cross section of a reinforcement structure for a singlelayer contact-less card. In this embodiment, the reinforcement structure620 is a cap-type reinforcement structure. The cap-type reinforcementstructure has a substantially planar portion 650 like the plate-typereinforcement structure, plus a flange 651 (or flanges) which extendinto first opening 631 in the upper surface 602 of layer 601. Module 630is disposed into second opening 632 in upper surface 602. FIGS. 7a-d areisometric views of various cap-type reinforcement structures inaccordance with the present invention. FIGS. 7a-d illustrate circularreinforcement structure 700a, square reinforcement structure 700b,rhomhic (or diamond-shaped) reinforcement structure 700c and octagonalreinforcement structure 700d, respectively. Referring to FIG. 7a, itwill be noted that reinforcement structure 700a includes wall 701 whichterminates at edge 702 and surface 703. The thickness of well 701 isindicated by T between the arrows. Reinforcement structures 700b-700d,although shaped differently, each have a wall which terminates at anedge and a surface, upper and lower edges providing a cap-typestructure. Any polygonal or round shape may be used as the substantiallyplanar portion of a cap-type reinforcement structure.

Although the embodiments of FIGS. 4 and 6 show plate-type and cap-typereinforcement structures in contact-less embodiments, thesereinforcement structures can also be used in single layer contact typeembodiments as shown in FIGS. 8-10. In FIG. 8, a first opening 831 isformed in the lower surface 803 of layer 801 (of card 800). Washer-typereinforcement structure 820 is affixed within first opening 831. Module830 is affixed in second opening 832 in upper surface 802 of layer 801.Contacts, such as contact 808, are exposed at the upper surface 802 oflayer 801.

Similarly, in FIG. 9, washer-type reinforcement structure 920 is affixedin a first opening 931 formed in the lower surface 903 of layer 901 (ofcard 900). Module 930 is affixed in second opening 932 in upper surface902 of layer 901. Contacts, such as contact 908, are exposed at theupper surface 902 of layer 901.

In FIG. 10, cap-type reinforcement structure 1020 is affixed in a firstopening 1031 in the lower surface 1003 of layer 1001 (of card 1000).Module 1030 is affixed in second opening 1032 in the upper surface 1002of layer 1001. Contacts, such as contact 1008, are exposed at the uppersurface 1002 of layer 1001.

FIG. 11 is a cross section of a molded contact-less type of card inaccordance with the present invention. The card 1100 is constructed of asingle molded layer 1101 which encloses the reinforcement structure 1120and the module 1130. As in the other embodiments, the reinforcementstructure 1120 has a higher modulus of elasticity than the molded layer1101. The reinforcement structure of this embodiment is not limited towasher-type reinforcement structure 1120, but also includes plate-typeand cap-type reinforcement structures.

In alternate embodiments of the present invention, the card containingthe module and reinforcement structure is laminated. FIGS. 12-17illustrate two-layer embodiments which may be used for contact-lesscards.

FIG. 12 is cross section of a contact-less card 1200 in accordance withthe present invention. As shown in FIG. 12, a reinforcement structure1220, is affixed in first opening 1231 in the upper surface 1202 offirst layer 1201. Module 1230 is similarly affixed in second opening1232 in the upper surface 1202. Lower surface 1206 of second layer 1204is affixed to the upper surface 1202 of first layer 1201 to form alaminated structure. This affixing may be performed using variousmethods including but not limited to a heat activated adhesive, acontact adhesive, thermal fusing, ultrasonic welding or an epoxyadhesive. The reinforcement structure of this embodiment is not limitedto washer-type reinforcement structure 1220, but also includesplate-type and cap-type reinforcement structures.

FIG. 13 illustrates a cross section of a reinforcement structure whichextends through multiple layers of contact-less card 1300. Reinforcementstructure 1320 is disposed in a first opening 1331 in upper surface 1302of first layer 1301. Module 1330 is disposed in a second opening 1332 inupper surface of first layer 1301. Reinforcement structure 1320 is alsodisposed in a third opening 1333 in lower surface 1306 of second layer1304. Module 1330 is also disposed in a fourth opening 1334 in lowersurface 1306 of second layer 1304. The upper surface 1302 and lowersurface 1306 are then affixed to one another using one of the methodspreviously described. First opening 1331, second opening 1332, thirdopening 1333 and fourth opening 1334 are created in first and secondlayers 1301, 1304, with proper alignment, prior to assembly.

FIG. 14 illustrates a cross section of a reinforcement structure locatedwithin a single layer of multiple layer, contact-less card 1400.Reinforcement structure 1420 is disposed in a first opening 1431 inupper surface 1402 of first layer 1401. Module 1430 is partiallydisposed in a second opening 1432 in upper surface of first layer 1401.A portion of module 1430 is disposed in a third opening 1433 in lowersurface 1406 of second layer 1404. The upper surface 1402 and lowersurface 1406 are affixed to one another using one of the methodspreviously described. Second opening 1432 and third opening 1433 arecreated in first and second layers 1401, 1404, with proper alignment,prior to assembly.

FIG. 15 illustrates a cross section of a reinforcement structure whichextends through multiple layers of contact-less card 1500. Reinforcementstructure 1520 is disposed in a first opening 1531 in upper surface 1502of first layer 1501. Module 1530 is disposed in a second opening 1532 inupper surface of first layer 1501. Reinforcement structure 1520 is alsodisposed in a third opening 1533 in lower surface 1506 of second layer1504. The upper surface 1502 and lower surface 1506 are affixed to oneanother using one of the methods previously described. First opening1531 and third opening 1533 are created in first and second layers 1501,1504, respectively, with proper alignment prior to assembly.

FIG. 16 illustrates a cross section of a reinforcement structure locatedwithin a single layer of multiple layer, contact-less card 1600.Reinforcement structure 1620 is disposed in a first opening 1631 inlower surface 1603 of first layer 1601. A first portion of module 1630is disposed in a second opening 1632 in upper surface 1602 of firstlayer 1601. Another portion of module 1630 is disposed in a thirdopening 1633 in lower surface 1606 of second layer 1604. Upper surface1602 and lower surface 1606 are affixed to one another using one of themethods previously described. Second opening 1632 and third opening 1633are created in first and second layers 1601, 1604, with properalignment, prior to assembly. The reinforcement structure of thisembodiment is not limited to plate-type reinforcement structure 1620,but also includes washer-type and cap-type reinforcement structures.

FIG. 17 is cross section of a contact-less card 1700 in accordance withthe present invention. As shown in FIG. 17, a reinforcement structure1720, is affixed in first opening 1731 in the lower surface 1703 offirst layer 1701. Module 1730 is similarly affixed in second opening1732 in the upper surface 1702. Lower surface 1706 of second layer 1704is bonded to the upper surface 1702 of first layer 1701 using one of thebonding methods previously described. She reinforcement structure ofthis embodiment is not limited to plate-type reinforcement structure1720, but also includes washer-type and cap-type reinforcementstructures

FIGS. 18-21 illustrate two-layer embodiments which may be used forcontact-type cards.

FIG. 18 is cross section of a contact type card 1800 in accordance withthe present invention. Reinforcement structure 1820, is affixed in firstopening 1831 in the lower surface 1803 of first layer 1801. Module 1830is affixed in second opening 1832 in the upper surface 1802 of firstlayer 1801. Contacts, such as contact 1808 of module 1830, are exposedat the upper surface 1802 of first layer 1801. Lower surface 1803 offirst layer 1801 is bonded to the upper surface 1805 of second layer1804 using one of the methods previously described to form a laminatedstructure. The reinforcement structure of this embodiment is not limitedto plate-type reinforcement structure 1820, but also includeswasher-type and cap-type reinforcement structures.

FIG. 19 illustrates a cross section of a reinforcement structure whichextends through multiple layers of contact type card 1900. Reinforcementstructure 1920 is disposed in a first opening 1931 in upper surface 1902of first layer 1901. Reinforcement structure 1920 is also disposed in athird opening 1933 in lower surface 1906 of second layer 1904. Module1930 is disposed in a second opening 1932 which extends through secondlayer 1904 and into upper surface 1902 of first layer 1901. Contacts,such as contact 1908 of module 1930, are exposed at the upper surface1905 of second layer 1904. Lower surface 1906 of second layer 1904 isbonded to the upper surface 1902 of first layer 1901 using one of themethods previously described to form a laminated structure.

FIG. 20 illustrates a cross section of a reinforcement structure whichis contained within a single layer of contact type card 2000.Reinforcement structure 2020 is disposed in a first opening 2031 inupper surface 2002 of first layer 2001. Module 2030 is disposed in asecond opening 2032 which extends through second layer 2004 and intoupper surface 2002 of first layer 2001. Contacts, such as contact 2008of module 2030, are exposed at the upper surface 2005 of second layer2004. Lower surface 2006 of second layer 2004 is bonded to the uppersurface 2002 of first layer 2001 using one of the methods previouslydescribed to form a laminated structure.

FIG. 21 illustrates an alternate embodiment of the structure of FIG. 20,substituting a plate-type reinforcement structure for the washer-typereinforcement structure. FIGS. 22-24 illustrate the steps used to createthe structure of FIG. 21. First opening 2131 (FIG. 22) is formed in theupper surface 2102 of first layer 2101 by punching, milling, machiningor etching first layer 2101. First opening 2131 is dimensioned toreceive plate-type reinforcement structure 2120. Reinforcement structure2120, is affixed in opening 2131 with an adhesive or by a methodpreviously described (FIG. 23). Second layer 2104 is then bonded tofirst layer 2101. Second opening 2132 is then formed by punching,milling, machining or etching through second layer 2104 and plate 2120.In an alternate embodiment, second opening 2132 may extend into firstlayer 2101. Module 2130 is affixed in opening 2132 using an adhesive (oranother method as previously described), resulting in the structure ofFIG. 21. Contacts, such as contact 2108 of module 2130, are exposed atthe upper surface 2105 of second layer 2104.

Alternately, the card of FIG. 21 may be constructed by using areinforcement structure and second layer which have pre-formed openingssuch that the second opening is formed when the first layer and secondlayer are bonded together.

FIG. 25 illustrates a cross section of a reinforcement structure whichextends through multiple layers of contact type card 2500. Reinforcementstructure 2520 is disposed in a first opening 2531 in upper surface 2502of first layer 2501. Reinforcement structure 2520 is also disposed in athird opening 2533 which extends into the lower surface 2506 of secondlayer 2504. Lower surface 2506 of second layer 2504 is bonded to theupper surface 2502 of first layer 2501 using one of the methodspreviously described. Module 2530 is disposed in second opening 2532 inupper surface 2505 of second layer 2504. Contacts, such as contact 2508of module 2530, are exposed at the upper surface 2505 of second layer2504.

FIG. 26 illustrates a cross section of a reinforcement structure whichis contained within a single layer of contact type card 2600.Reinforcement structure 2620 is disposed in a first opening 2631 inlower surface 2603 of first layer 2601. Module 2630 is disposed in asecond opening 2632 which extends through second layer 2604 and intoupper surface 2602 of first layer 2601. Contacts, such as contact 2608of module 2630, are exposed at the upper surface 2605 of second layer2604. Lower surface 2606 of second layer 2604 is bonded to the uppersurface 2602 of first layer 2601 using one of the methods previouslydescribed to form a laminated structure. The reinforcement structure ofthis embodiment is not limited to plate-type reinforcement structure2620, but also includes washer-type and cap-type reinforcementstructures.

FIG. 27 illustrates a cross section of a reinforcement structure whichis contained within a single layer of contact type card 2700.Reinforcement structure 2720 is disposed in a first opening 2731 inupper surface 2702 of first layer 2701. Module 2730 is disposed in asecond opening 2732 in the upper surface 2705 of second layer 2704.Contacts, such as contact 2708 of module 2730, are exposed at the uppersurface 2705 of second layer 2704. Lower surface 2706 of second layer2704 is bonded to the upper surface 2702 of first layer 2701 using oneof the methods previously described to form a laminated structure. Thereinforcement structure of this embodiment is not limited to plate-typereinforcement structure 2720, but also includes washer-type and cap-typereinforcement structures.

FIG. 28 illustrates a cross section of a reinforcement structure whichis contained within a single layer of contact type card 2800.Reinforcement structure 2820 is disposed in a first opening 2831 inlower surface 2803 of first layer 2801. Module 2830 is disposed in asecond opening 2832 in the upper surface 2805 of second layer 2804.Contacts, such as contact 2808 of module 2830, are exposed at the uppersurface 2805 of second layer 2804. Lower surface 2806 of second layer2804 is bonded to the upper surface 2802 of first layer 2801 using oneof the methods previously described to form a laminated structure. Thereinforcement structure of this embodiment is not limited to plate-typereinforcement structure 2820, but also includes washer-type and cap-typereinforcement structures.

In an alternate embodiment of the present invention, the module to beprotected is disposed directly into a reinforcement structure. FIGS.29-31 are cross sections of contact-less cards which utilize such areinforcement structure.

FIG. 29 is cross section of a molded single layer contact-less card 2900in accordance with the present invention. As shown in FIG. 29, a module2930 is affixed in a first opening 2951 in upper surface 2921 ofreinforcement structure 2920. Module 2930 and reinforcement structure2920 are molded within a single layer 2901 of card 2900 using the methodpreviously described in connection with the molded card embodiment shownin FIG. 11.

FIG. 30 is a cross section of a two layer contact-less card 3000 havinga reinforcement structure located within a single layer. Module 3030 isaffixed in a first opening 3051 in upper surface 3021 of reinforcementstructure 3020. Reinforcement structure 3020 is affixed in secondopening 3052 in the upper surface 3002 of first layer 3001. The bottomsurface 3006 of second layer 3004 is affixed to the upper surface 3021of reinforcement structure 3020 and to the upper surface 3002 of firstlayer 3001.

FIG. 31 is a cross section of a two layer contact-less card 3100 havinga reinforcement structure located in both layers. Module 3130 is affixedin a first opening 3151 in upper surface 3121 of reinforcement structure3120. Reinforcement structure 3120 is affixed in second opening 3152 inthe upper surface 3102 of first layer 3101. A third opening 3153 in thebottom surface 3106 of second layer 3104 receives the reinforcementstructure 3120. Bottom surface 3106 of second layer 3104 is affixed tothe upper surface 3121 of reinforcement structure 3120 and to the uppersurface 3102 of first layer 3101.

FIGS. 32-34 are cross sections of contact-type cards which utilize areinforcement structure which directly receives the module.

FIG. 32 is a cross section of a single layer contact-type card 3200having a reinforcement structure which directly receives a module.Module 3230 is affixed in a first opening 3251 in upper surface 3221 ofreinforcement structure 3220. Reinforcement structure 3220 is affixed insecond opening 3252 in the upper surface 3202 of first layer 3201.Contacts, such as contact 3208 of module 3230, are exposed at the uppersurface 3202 of first layer 3201.

FIG. 33 is a cross section of a two layer contact-type card 3300 havinga reinforcement structure located in both layers. Module 3330 is affixedin a first opening 3351 in upper surface 3321 of reinforcement structure3320. Reinforcement structure 3320 is affixed in second opening 3352 inthe upper surface 3302 of first layer 3301. Reinforcement structure 3320extends through a third opening 3353 in second layer 3304 such thatcontacts, such as contact 3308, are exposed at upper surface 3305 ofsecond layer 3304. Bottom surface 3306 of second layer 3304 is affixedto the upper surface 3302 of first layer 3301.

FIG. 34 is a cross section of another two layer contact-type card 3400having a reinforcement structure located in both layers. Module 3430 isaffixed in a first opening 3451 in upper surface 3421 of reinforcementstructure 3420. Bottom surface 3406 of second layer 3404 is affixed tothe upper surface 3402 of first layer 3401. Reinforcement structure 3420is affixed in second opening 3452 which extends through second layer3404, the upper surface-3402 of first layer 3401 and part of first layer3401. Contacts, such as contact 3408, are exposed at the upper surface3402 of second layer 3404.

The position of the reinforcement structure/module pair may bedetermined by ISO standard or by the card designer. It should be notedthat the torque at any point on a card is inversely proportional to theradius of curvature at that point. In card 3500 illustrated in FIG. 35,the smallest radius, and hence the largest torque, occurs at mid-point3501. Thus, to further reduce stress on the module, in certainembodiments it may be desirable to locate the reinforcementstructure/module pair(s) away from the mid-point 3501 of the card. Inother embodiments, the reinforcement structure may allow the module tobe located closer to the mid-point 3501 than it could be in the absenceof the reinforcement structure.

In alternate embodiments of the present invention, additional layers maybe added to the card. FIG. 36 illustrates an embodiment in which anadditional layer is added to a card similar to the card illustrated inFIG. 21. The upper surface 3612 of third layer 3610 is affixed to thelower surface 3603 of the first layer 3601. Third layer 3610 is a clearplastic such as PVC, PET or polycarbonate, thereby allowing artwork3615, such as advertising or instructions to be placed either the uppersurface 3612 of third layer 3610 or the lower surface 3603 of firstlayer 3601. Because first layer 3601 is bonded to third layer 3610, theartwork 3615 is protected from scratching.

FIG. 37 is a cross section of a card 3700 according to an alternateembodiment of the present invention. FIGS. 38a-d are cross sectionsillustrating a method for fabricating card 3700 of FIG. 37. Asillustrated in FIG. 38a, a first opening 3731 is created in first layer3701. In the illustrated embodiment, first opening 3731 extendscompletely through first layer 3701. However, in other embodiments,first opening 3731 does not extend completely through first layer 3701.Cap type reinforcement structure 3720 is similar to the reinforcementstructures illustrated in FIGS. 7a-d; however, cap type reinforcementstructure 3720 includes a flange portion 3752 which extends away fromthe rest of the reinforcement structure. Cap type reinforcementstructure 3720 is inserted into the first opening 3731 such that theflange 3752 of reinforcement structure 3720 rests on the upper surface3702 of first layer 3701 (FIG. 38b). Reinforcement structure 3720 can beaffixed to first layer 3701 at the interface between the flange 3752 andthe upper surface 3702 of the first layer 3701 using and adhesive oranother suitable method. In another embodiment, reinforcement structure3720 is not affixed to the first layer 3701 in the manner previouslydescribed. Instead, second layer 3704 is built up by adding one or morelayers over the upper surface 3702 of first layer 3701 and reinforcementstructure 3720 (FIG. 38c). Second layer 3704 is created by heatlaminating additional layers of material onto first layer 3701 andreinforcement structure 3720. FIG. 38c illustrates the resultingstructure, with reinforcement structure 3720 held between first layer3701 and second layer 3704. As illustrated in FIG. 38d, a second opening3732 is formed in the upper surface 3705 of second layer 3704. Module3730 is then affixed in second opening 3732 using a method previouslydescribed.

Variations of the embodiment illustrated in FIG. 37 are shown in FIGS.39 and 40. FIG. 39 is a cross section of a card 3900 having areinforcement structure 3920 with a flange 3952 which extends to theedges of card 3900. FIG. 40 is a cross section of a card 4000 having areinforcement structure 4052 which is positioned closer to the uppersurface 4005 of second layer 4004.

FIG. 41 is a cross section of a card 4100 according to an alternateembodiment of the present invention. Reinforcement structure 4120 is acap type reinforcement structure which surrounds first layer 4101,except for the upper surface 4102 of first layer 4101. In oneembodiment, card 4100 is fabricated by affixing reinforcement structure4120 onto first layer 4101 using a method previously described. Inanother embodiment, card 4100 is fabricated by molding first layer 4101within reinforcement structure 4120. A first opening 4131 is created inthe upper surface 4102 of first layer 4101. Module 4130 is affixed infirst opening 4131. Reinforcement structure 4120 can be made ofmaterials such as metals, graphite reinforced materials and plastics.

FIG. 42 is a cross section of a card 4200 according to an alternateembodiment of the present invention. Reinforcement structure 4220-1 is acap type reinforcement structure which surrounds first layer 4201,except for the upper surface 4202 of first layer 4201. The reinforcementstructure 4220-1 and first layer 4201 are created using one of themethods previously described in connection with card 4100 (FIG. 41). Afirst opening 4231 is created in the upper surface 4202 of first layer4201. Module 4230 is affixed in first opening 4131. A second cap typereinforcement structure 4220-2 is positioned over reinforcementstructure 4220-2. Reinforcement structure 4220-2 can be held onreinforcement structure 4220-1 in various ways which include the use ofan adhesive or an interference fit. An opening, such as opening 4232, isprovided in reinforcement structure 4120-1 to allow access to contacts,such as contact 4208, on module 4130. In a contact less embodiment,opening 4232 is omitted. Reinforcement structures 4220-1 and 4220-2 canbe made of materials such as metals, graphite reinforced materials andplastics.

Although the present invention has been described in connection withseveral embodiments, variations of these embodiments will be obvious toone of ordinary skill in the art. For example, an additional layer maybe affixed over the contact-type structures to create a contact-lessstructure. Additional layers may be added to create cards having morethan two layers. Furthermore, the present invention can be used inflexible cards having dimensions other than the dimensions specified byISO standards. Accordingly, the present invention is limited only by theclaims as set forth below.

What is claimed is:
 1. A semi-rigid card comprising:a first semi-rigidlayer having a first modulus of elasticity, wherein a first openingextends through the first semi-rigid layer; a reinforcement structurehaving a second modulus of elasticity higher than the first modulus ofelasticity, wherein the reinforcement structure has a first portionwhich is located in the first opening and a second portion which extendsover an upper surface of the first semi-rigid layer; a second semi-rigidlayer having the first modulus of elasticity, wherein the secondsemi-rigid layer is located over the upper surface of the firstsemi-rigid layer and the reinforcement structure; and a module having anelectronic component, said module disposed in said second semi-rigidlayer, wherein said module and said reinforcement structure areseparated by said second semi-rigid layer.
 2. The semi-rigid card ofclaim 1, wherein said module has contacts which are exposed at a surfaceof said second semi-rigid layer.
 3. The semi-rigid card of claim 1,wherein the reinforcement structure is polygonal or round.
 4. Thesemi-rigid card of claim 1, wherein the second portion of thereinforcement structure extends over the entire upper surface of thefirst semi-rigid layer.
 5. A method of making a semi-rigid card, themethod comprising the steps of:forming a first opening through a firstsemi-rigid layer having a first modulus of elasticity; disposing areinforcement structure having a second modulus of elasticity, higherthan the first modulus of elasticity, in the first opening, wherein thereinforcement structure has a first portion which is located in thefirst opening and a second portion which extends over an upper surfaceof the first semi-rigid layer; disposing a second semi-rigid layer overthe upper surface of the first semi-rigid layer and the reinforcementstructure; forming a second opening in the second semi-rigid layer,separated from the first opening; and disposing a module having anelectronic component in the second opening.
 6. The method of claim 5,wherein the reinforcement structure is polygonal or round.
 7. The methodof claim 5, wherein the second portion of the reinforcement structureextends over the entire upper surface of the first semi-rigid layer.